Altair Partners with TES International to Expand Thermal Analysis Tool Set

By DE Editors

Altair has added TES International’s  ElectroFlo software for thermal analysis to its HyperWorks Partner Alliance (HWPA). ElectroFlo is an electronics cooling package designed for high power-density applications. It is used for the thermal analysis of electrical components and systems. Altair HyperWorks customers can access ElectroFlo through the HWPA with their current HyperWorks units.

According to Altair, the software can be used in any electronics application from component-level to printed circuit board analysis, all the way up to the system level.  ElectroFlo has the capability to measure computational fluid dynamics (CFD) as well.

“We are excited to be a part of Altair’s innovative HyperWorks Partner Alliance,” said TES International’s president Jeff Lewis. “We are thrilled to be working closely with another well-respected high-tech company based in Michigan. This partnership is beneficial for all. It provides TES with access to Altair’s global customer base to further software adoption of ElectroFlo, meanwhile Altair customers have simplified access to a thermal analysis tool that is proven in the electronics industry and relevant for a variety of other industries. We look forward to incorporating our other products, ThermoFlo and TESuite, into this program in the near future and to a long-term relationship with Altair overall.”

For more information, visit Altair and TES International.

Sources: Press materials received from the company and additional information gleaned from the company’s website.