ANSYS Calls for Papers

By DE Editors

ANSYS, Inc. (Canonsburg, PA) issued a call for papers for the “world’s first” commercial computer-aided engineering (CAE) conference dedicated to the building services industry.

The European Built Environment CAE Conference (EBECC) will be held in London, UK, June 5 and 6, 2008, to provide a forum for the application of engineering simulation technology specific to the industry.

Presentations are invited from representatives of industry-leading companies to accompany those from ANSYS experts. Papers should highlight innovative and interesting applications using the very latest state-of-the-art simulation technologies in CAE-related disciplines, including computational fluid dynamics (CFD) for airflow modeling and finite element analysis (FEA) for structural studies.

Application examples highlighting the use of integrated multiphysics simulation are particularly welcome. Papers are being sought on application areas including: Occupant comfort (offices, atria, public buildings, underground trains and stations); Specialist design considerations (seismic response, cyclic loading on structures, cooling of data centers); Wind engineering (pressure mapping, pedestrian comfort, structural loading); Fire and safety (fire modeling, smoke transport, fire suppression, structural resilience); Homeland security (explosion modeling, chemical and biological gas spread); HVAC and refrigeration equipment (fans, chilled beams, facades, diffusers, grills, noise modeling).

EBECC presentations will be designed to address industry requirements, demonstrating how analysis has contributed to design and engineering processes and helped assure that operational performance is not compromised. Papers will be given on specific technologies and case studies that highlight best practice, demonstrating both the engineering and business case for the application of CAE.

Abstracts of papers should be submitted by no later than February 29, 2008. For information on submitting a paper, visit EBECC.

For other details, visit ANSYS, Inc.