CoreTech Releases MOldex3D R11.0

Software is targeted at high-end injection molding simulations.

Software is targeted at high-end injection molding simulations.

By DE Editors

CoreTech System announced the latest release of its Moldex3D R11.0 plastic design and analysis software for high-end injection molding simulations.

The company has re-positioned Moldex3D R11.0 as four solution packages,  including eDesign Basic, eDesign, Professional, and Advanced. The solution includes new tools that enable users to design various feeding and cooling systems depending on individual needs more easily. It also highly improves the quality of mesh generation, which will help users better portray unique model features with complicated geometry and acquire more accurate simulation results.

The new release supports a venting analysis that helps users solve potential incomplete fills in cavities more effectivelyl ,and a core shift analysis to simulate the deflection results of part inserts due to imbalanced pressure in the filling process. Additionally, the Standard Cool solver adds visualization of 3D coolant flow in cooling channels for evaluation of baffle, bubbler and conformal cooling designs. The expanded Transient Cool analysis improves predictions of cooling inefficiency problems and can directly benefit conformal cooling circuit design. For encapsulation projects, users now can analyze wire crossing models and identify related troubles.

Moldex3D R11.0 also introduces several new modules, including Advanced Hot Runner, Co-Injection Molding, Microcellular Foaming (MuCell), and Underfill Encapsulation (Underfill), to simulate the 3D molding phenomena in these special injection molding processes. Key process parameters can be investigated, and major molding defects can be predicted for design verification and process optimization.

For more information, visit CoreTech.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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DE Editors

DE’s editors contribute news and new product announcements to Digital Engineering.
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