Flow Science Releases FLOW-3D ThermoSET

By DE Editors

Flow Science, Inc.’s FLOW-3D ThermoSET, a computer-aided engineering (CAE) package aimed at the development and production of products using thermosetting resins.

Thermosetting resins are used in semiconductor devices, generators, transformers and switches, coils and other components for electric vehicles and hybrid electric vehicles,  printed circuit boards, and MRIs. These materials present challenging problems in the production process, which FLOW-3D ThermoSET is designed to help engineers overcome.

Working with Hitachi Corporation and Terrabyte Corporation of Japan, which collaborated on the development of this customized version of FLOW-3D, Flow Science now offers engineers seeking to tackle these problems a tool to produce predictions of void formations, incomplete filling, overfilling, and gold wire deformations.

For more information, visit Flow Science.

Sources:  Press materials received from the company and additionalinformation gleaned from the company’s website.