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Fluid Flow Simulation Helps Thermal Design

By DE Editors

A FloTHERM simulation showing a front view of the chassis.

Elma Electronic (Wetzikon, Switzerland & Fremont, CA) used FloTHERM thermal simulation software from the Mentor Graphics Mechanical Analysis Division (formerly Flomerics) (Wilsonville, OR) to optimize the design of a new Advanced Telecommunications Computing Architecture (ATCA) platform that is designed to dissipate up to 300 watts in each of its 14 slots.

Elma thermal engineers used FloTHERM’s capability to automatically run a series of flow simulations while varying various dimensions and other parameters to achieve design goals such as maximizing airflow over the boards.

Recently, Elma made the decision to develop a 13U ATCA platform that dissipates 4200 watts in the 14 main slots plus another 1120 watts in a rear transition module (RTM). The boards themselves are 8U tall leaving only 5U for cooling including the fans and intake and exhaust plenums.

For more information, visit Mentor Graphics.

For recent DE coverage, see “Airflow Simulation Helps Retrofit Schools for AC,” (Nov. 2008).

Sources: Press materials received from the company and additional information gleaned from the company’s website.

About DE Editors

DE's editors contribute news and new product announcements to Digital Engineering. Press releases can be sent to them via DE-Editors@digitaleng.news.