HP Focuses on 3D Printing Materials

Unveils 3D printing Material Development Kit and showcases world’s first 3D Open Materials and Applications Lab

HP Inc. enhanced its open platform for 3D printing materials and production-ready applications development. HP’s open platform model for 3D printing helps expand the availability of new materials and addresses broader applications. The open platform model also helps lower materials and development costs, drive speed and performance improvements, and create new possibilities for part properties meeting specific industry needs, according to the company.

HP, in collaboration with SIGMADESIGN, will offer an MDK for 3D printing materials, with an expanding array of materials for end customers and a simplified certification and testing process for partners.

An integral element of HP’s open platform strategy for 3D printing, the MDK will enable companies interested in certifying their materials to quickly test 3D powder spread-ability and compatibility with HP Jet Fusion 3D printers prior to submitting the materials to HP for testing.

“HP is leading the evolution of 3D printing from prototyping to production and SIGMADESIGN understands how important each step of the manufacturing process is in this journey,” says Bill Huseby, president and CEO, SIGMADESIGN. “Materials are at the center of successful manufacturing, and the combination of HP’s open platform and the ability to enable voxel-level control will help expedite the digital transformation of this multi-trillion dollar market.”

The MDK is expected to ship this spring.

In related news, HP has unveiled its laboratory to help companies develop, test and deliver the next generation of materials and applications for 3D printing. Located in Corvallis, OR, the new HP 3D Open Materials and Applications Lab will offer partners a range of equipment and in-house expertise to accelerate materials and applications innovation.

For more information, visit HP and SIGMADESIGN.

Sources: Press materials received from the company.

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