Keithley Unveils High Power Wafer-Level Testing

Keithley Instruments announced new enhancements to its Automated Characterization Suite (ACS) software that support its expanding family of high power semiconductor characterization solutions. The ACS package is optimized for automated wafer-level parameter test applications, including automated characterization, reliability analysis, and known good die testing. The ACS V5.0 update specifically leverages the high power capabilities of Keithley’s Model 2651A (high current) and Model 2657A (high voltage) System SourceMeter SMU instruments to enable automated wafer-level testing of high power semiconductor devices like power MOSFETs, IGBTs, BJTs, diodes, etc.

The update includes high power device libraries designed for use with the Models 2651A (up to 50A or 100A when connecting two units) and 2657A (up to 3,000V) System SourceMeter SMU instruments; support for hardware scan, recognition, and configuration management of the high power Models 2651A and 2657A; and support for Series 2600 SMU instruments equipped with the TSP-Link inter-unit communication bus, leveraging the on-board test script processor (TSP) technology for a multi-processor environment that provides high parallel throughput while speeding and simplifying test project development.

For more information, visit Keithley Instruments.

Sources: Press materials received from the company and additional information gleaned from the company’s website.