Moldflow Releases Moldflow Plastics Insight 6.2

By DE Editors

Moldflow Corporation (Framingham, MA) released Moldflow Plastics Insight MPI 6.2, which is said to allow more people to work faster on larger models and interface to more applications. Plus, other technology enhancements allow users to improve their productivity.

With the MPI 6.2, 3D Flow solver analysis speed has more than doubled, which results in faster turnaround time on projects. Because it supports Microsoft Windows 64-bit operating systems, it is suitable for handling large models and improving product performance.

MPI 6.2 also offers configurable Workspaces, which allow the user interface to be customized to fit a user’s job function, knowledge, skill set, and experience, thereby reducing implementation and support costs.

MPI 6.2 contains technology innovations for advanced gate location optimization, a micromechanics model to improve warpage predictions of fiber-filled materials, the extension of 3D gas-assist analysis to predict part warpage, simulation of a new rapid heating/cooling process, venting analysis of thermoset materials, and new application programming interface (API) commands to ensure MPI continues to tightly integrate with customer’s processes and workflows.

A new data export option in MPI 6.2 allows Moldflow results to be used in HyperStudy, Altair Engineering‘s (Troy,  MI) design and process optimization program. A new interface to CODE V,  the industry-leading optical design software from Optical Research Associates (ORA; Pasadena, CA),  allows MPI results to be used to investigate how the molding process affects the optical properties of lenses.

For details, go to Moldflow.

Sources:  Press materials received from the company and additional information gleaned from the company’s website.