Molex Releases MediSpec MID for High-Density Medical Device Design

By DE Editors

Molex introduced its MediSpec Molded Interconnect Device (MID) capabilities utilizing laser-directed structuring (LDS)  technology for high-density medical applications. The technology delivers packaged interconnect solutions that meet or exceed stringent medical device guidelines while providing reduced components and materials usage, fewer development and production processes, lower prototyping costs and faster time-to-market. 

The combined MID/LDS capabilities can help medical device designers integrate complex electrical and mechanical features into highly compact applications.  The MID 3D capability integrates both the electrical and mechanical design into a single molded device, which is ideal for miniaturization and is scalable from small to large volume production quantities. It enables numerous design configuration and material combination options, allowing medical device designers the flexibility to select plating and materials especially for small form factor applications. 

The LDS technology is also suitable for miniaturization strategies,  featuring circuitry that can be imaged with a 3-axis laser on a variety of RoHS-compliant plastics with pattern modification. 

For more information, visit Molex.

Sources: Press materials received from the company and additional information gleaned from the company’s website.