NI Introduces Advanced Connectivity for Multisim & LabVIEW

By DE Editors

National Instruments (NI; Austin, TX) announced further integration of the NI Multisim and LabVIEW platforms. By integrating the recently released Multisim 10.1 and LabVIEW, engineers can better identify and analyze design behavior and detect errors at the earliest stages of design. Additionally, with the beta version of the NI LabVIEW Multisim Connectivity Toolkit, engineers now can enhance circuit design.

NI Multisim 10.1 ($1,499) makes it possible to interactively build circuit schematics and simulate circuit behavior in a highly graphical environment. Because Multisim abstracts the complexity of SPICE simulation, engineers do not need in-depth SPICE expertise to quickly capture, simulate and analyze new designs. With enhanced simulation, engineers experience fewer design errors and achieve a quicker prototype turnaround with fewer iterations.

Multisim 10.1 introduced professional design features including a focus on enhanced simulation capabilities, increased compatibility with PSpice models and a database of 300 new components from leading vendors, such as Analog Devices and Texas Instruments. Multisim 10.1 also features the Multisim Automation API to help engineers automate simulation with COM-aware programming languages. The beta version of the LabVIEW Multisim Connectivity Toolkit, which builds on Multisim 10.1, further integrates the capabilities of Multisim circuit design with the LabVIEW measurement platform.

The new LabVIEW Multisim Connectivity Toolkit combines these automation capabilities and makes it possible for LabVIEW to provide rapid connectivity to both simulation and real-world measurements of circuits.

With more than 80 new functions in the connectivity toolkit, engineers can run, pause,  and stop simulation as well as view circuit schematics in LabVIEW and change the component values. Readers can download a beta version of the connectivity toolkit for free.

For details, contact National Instruments.

Sources:  Press materials received from the company and additional information gleaned from the company’s website.