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December 4, 2001
REDCOM Laboratories Inc. announced the availability of a new high-speed Surface Mount Technology (SMT) assembly line at its headquarters in Victor, NY.
According to a company press release, the line will include state-of-the-art assembly and inspection equipment plus the latest on-line New Product Introduction and performance monitoring tools. The line will be used to assemble and inspect Printed Circuit Board Assemblies (PCBAs).
Some elements of the new system include:
- Universal Fuzion SMT Component Placement System (48K placements/hour)
- Vitronics Soltec XPM3i 820 Reflow Soldering System
- Vi Technology 5K SPECTRO Automated Optical Inspection
- Air-Vac Engineering ONYX 29 Advanced SMT Production Rework & Assembly
For more information, visit REDCOM Laboratories.
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About the Author
Jess LulkaJess Lulka is a former associate editor for Digital Engineering. Contact her via [email protected].
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