Semilab Licenses Intellectual Property from Applied Materials

IP focuses on technology and systems used in semiconductor applications for measuring implant and metal thickness.

IP focuses on technology and systems used in semiconductor applications for measuring implant and metal thickness.

By DE Editors

Semilab Co. Ltd. (Budapest, Hungary), known for its non-contact wafer mapping metrology solutions for the semiconductor and solar cell industries,  announced that it has licensed key patents and transferred relevant intellectual property (IP) from Applied Materials, Inc. (Santa Clara, CA)  What Allied Materials has to offer covers technology and systems used in semiconductor applications for measuring implant and metal thickness.

Applied Materials’ technology provides critical in-line parametric measurement capability on product wafers, covering implant junction depth and dose monitoring, and metal thickness, via and interconnect resistance measurements. Immediately available to Semilab’s customers are implant metrology systems.

Terms of the agreement were not disclosed.

For more information, visit Semilab  or Applied Materials, Inc.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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DE Editors

DE’s editors contribute news and new product announcements to Digital Engineering.
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