Siemon Announces New Passive Copper Cabling Assemblies

40+Gb/s SFF-8470 assemblies designed for high-speed data center interconnect applications.

40+Gb/s SFF-8470 assemblies designed for high-speed data center interconnect applications.

By DE Editors

Siemon has released 40+Gb/s SFF-8470 4X Passive Copper cabling products.  These SFF-8470 copper cable assemblies support high-speed interconnect applications such as high-performance computing (HPC), enterprise networking, and network storage systems. The low latency assemblies support data transfer rates from 2.5Gb/s to 10+ Gb/s per lane.

Siemon’s 8470 cable assemblies feature a shielded wafer construction where the signal conductors are directly attached to the connector’s contacts, eliminating a printed circuit board and enhancing noise resistance, according to the company.  The twin-axial shielded cable conductors are laser welded and support 10+Gb/s data rates.  SFF-8470 die cast back shells and latch are interoperable with compliant interfaces. 

The 8470 product supports an array of data protocols/interfaces, including InfiniBand  SDR, DDR and QDR; Ethernet 10GBaseCX4, 40GBaseCR4. These cables also support FibreChannel, RapidIO,  Myrinet, SAS, SATA, Aurora, VITA VXS and XAUI/XAUI-2 IO interface links as well as SONET/SDH. 

Product options available include 24 to 30 wire gauges and various assembly lengths for specific applications. 

For more information, visit Siemon.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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DE Editors

DE’s editors contribute news and new product announcements to Digital Engineering.
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