Speed Up Thermal Characterization of Semiconductor Packages

By DE Editors

Built upon Flomerics Inc.’s (Marlborough, MA)  FLOPACK SmartPart technology and FLOTHERM’s CFD solver, ThermPaq is designed to accelerate the process of semiconductor thermal characterization and design. ThermPaq provides a fast, simple, proven, automated process that reduces the number of distinct steps required to be performed by thermal experts, reducing the risk of modeling errors to enhance the quality, reliability, and availability of package thermal models.

ThermPaq is a wizard-driven web-based tool for engineers who are not thermal specialists to get a fully automated process for generating accurate package models and computing the complete set of JEDEC-compatible thermal characterization data. These include all Theta and Psi metrics under various environmental conditions and industry-standard compact thermal models. Interfacing with Cadence APD,  ThermPaq can take advantage of existing BGA layouts to capture metallization and via placement detail.

ThermPaq also serves as a design tool for thermal specialists. Changes in thermal performance can be investigated through parametric variation of key package parameters to optimize the package thermal design.

For details on ThermPaq, contact Flomerics.

Sources:  Press materials received from the company and additional information gleaned from the company’s website.