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Tag Archives: High-performance Computing (HPC)

Editor’s Pick: PAM-STAMP 2018 Debuts

ESI Group's PAM-STAMP provides capabilities for sheet metal stamp simulation from style to design and from part to die production. Shown here is a part after quenching. AP&T image courtesy of the ESI Group.

ESI says its end-to-end sheet metal forming simulation solution can help engineers realize lightweight designs using innovative materials.

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PAM-STAMP 2018 Debuts

PAM-STAMP provides topology check, clean up and repair features. Shown here is the lower part of a press hardening die of a dash panel. AP&T image courtesy of the ESI Group.

ESI says its end-to-end sheet metal forming simulation solution can help engineers realize lightweight designs using innovative materials.

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ESI Debuts PAM-STAMP 2018

Component quality assessment in ESI PAM-STAMP 2018’s Virtual Light Room, based on simulation results. Image courtesy of ESI.

End-to-end solution from ESI designed to help engineers realize lightweight designs using innovative materials.

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High-Performance Computing and the Art of Innovation

The challenge for today’s engineering companies is to ensure that creative ideas are efficiently converted into real-world products and delivered at industrial scale.

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