August 9, 2010
By DE Editors
Tech-X Corporation has announced the release of VORPAL v4.2. VORPAL is a software framework that enables electromagnetic and electrostatic simulations composed of particles and fluids for 1D, 2D, and 3D geometries.
According to the company, new capabilities will allow researchers to apply VORPAL in new application areas and enable more advanced simulations of the physics being studied. New capabilities include additional collision models, import of user-defined secondary electron yield data, a new photoemission model, and delta-F particles for modeling tokamak geometries.
Originally released in 2005, VORPAL offers a combination of physical models to cover the range of plasma simulation problems. Laser wakefield accelerators, plasma thrusters, high-power microwave guides, and plasma processing chambers are only a few of the many applications benefiting from the parallel algorithms incorporated into the VORPAL framework.
For more information, visit Tech-X Corporation.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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