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WIN Enterprises Announces 3.5-Inch SBC with AMD Embedded G-Series SOC

Includes L2 cache and DDR3 memory controller.

Includes L2 cache and DDR3 memory controller.

WIN Enterprises announced the MB-60830, a 3.5-in. SBC featuring the new AMD Embedded G-Series SoC with integrated chipset and discrete-class AMD Radeon Graphics Processing Unit.

From a usage standpoint, the new 28nm processor is a single-chip solution that can be used on boards like MB-60830 to accelerate 3D graphics, as well as to support more generalized embedded computing applications, the company says.  Applications can span digital signage, gaming, medical imaging, kiosks/POS, thin client and factory automation.

In addition to its integrated chipset and AMD Radeon 8000 Series graphics, the AMD Embedded G-Series SoC integrated components include L2 cache and a DDR3 memory controller. The platform also includes enterprise-class Error-Correction Code (ECC) memory support, industrial temperature range of -40 °C to +85 °C, and is available with dual or quad-core CPUs based on AMD’s next-generation Jaguar architecture.

For more information, visit WIN Enterprises.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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