Digital Engineering July/August 2023
The July/August issue of Digital Engineering focuses on innovations in electronics design, including cloud-based ECAD, electronic toy design, PLM for electronics, quality control in 3D printing, and a review of the BOXX APEXX S3 workstation.
August 1, 2023
Inside This Issue:
Subscription-Based Software: The New Normal?
Licensing models are slowly changing to be subscription based across the industry. But many organizations still use perpetual licensing.
SaaS Gains Ground in ECAD
Simulation drives ECAD to subscription.
Playful Magic and Functional Esthetics
Incorporating electronics to raise the bar for toys and accessories.
How Well Can PLM Support Electronics Developers?
Until now, PLM has made limited inroads into the electronics design and development sector.
Production-grade AM Gets Quality Boost
Advances in artificial intelligence, in-situ monitoring and process control are picking away at longstanding concerns about additive manufacturing part quality, but more work needs to be done.
Choosing the Right Computing Options for Enhanced Workflows
Getting the ideal hardware for your engineering applications isn’t just about the price tag.
Top Performance Winner: BOXX APEXX S3
The latest workstation from BOXX beats the performance of its predecessor.
Download today
Latest News
Sustainable Packaging Requires an Innovative Data-Driven Ecosystem
Sustainable packaging is a complex challenge that cuts across several evolving manufacturing developments.
Dyndrite Awarded for LPBF Qualification
Efforts to bring documented improvements to metal 3D printing operational qualification.
Centric Debuts SOLIDWORKS PDM Connect 1.0
The new SOLIDWORKS PDM Connect 1.0 connector links files from SOLIDWORKS PDM to Centric PLM and automates the export of native ...
America Makes Winners of Open Project Call Announced
Awardees have identified the current, emerging, and future state of AM process qualification, prioritizing AM machine qualification.
GenAI Sets Off Digital Engineering Technology Shift in U.S.
Enterprises embracing new tools, agile approaches to accelerate development, according to new ISG report.
BMF Launches Hybrid Micro-Precision 3D Printer Series
The microArch D1025 dual-resolution 3D printer delivers flexible, high-precision 3D printing of parts that require micron-level precision and repeatability.
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New & Noteworthy
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Coreform Cubit 2023.11 workflows enable neutronics directly on CAD for next-generation nuclear energy...
New & Noteworthy: Agile Engineering Collaboration
Authentise Threads is a new software tool for distributed communications and project...
New & Noteworthy Product Introduction: Enterprise VR Headset
Lenovo ThinkReality VRX has an immersive display works with virtual, augmented and...