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LIVE Webcast: Understanding the “Cool” Factor in CFD

DE LIVE webcast with Autodesk on flow simulation (image courtesy of Autodesk).

As IoT and other devices are being squeezed into tiny form factors, electronic designs are getting ever more complicated. So how can you keep your electronics from overheating?

In this LIVE webinar moderated by DE, Autodesk CFD guru Dave Graves discusses ways to optimize thermal performance by tweaking the following:

  • Air flow
  • Component Placement
  • Heat Sink Performance
  • Fan Placement

DATE: Tuesday, May 15, 2018
TIME: 2:00 pm ET/ 11:00 am PT

To register, go here.

Dave Graves, Autodesk, featured speaker for the webcast.

About Dave Graves, Autodesk
Dave has a mechanical engineering degree from NC State University and currently resides in Charlottesville, VA. He has spent the first part of his career in the design and manufacturing of Telecommunications equipment but has spent the last several years in the CAE industry. As a Sr. Application Engineer with Blue Ridge Numerics, Dave has over 10 years of product experience with what was formerly known as CFdesign, now know as Autodesk CFD.

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About Kenneth

Kenneth Wong has been a regular contributor to the CAD industry press since 2000, first an an editor, later as a columnist and freelance writer for various publications. During his nine-year tenure, he has closely followed the migration from 2D to 3D, the growth of PLM (product lifecycle management), and the impact of globalization on manufacturing. His writings have appeared in Cadalyst, Computer Graphics World, and Manufacturing Business Technology, among others.

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